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product structure silicon monolithic integrated circuit this product is not designed protection against radioactive ra ys . 1/ 18 tsz02201-0r2r0g100300-1-2 ? 2012 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 tsz22111 ? 14 ? 001 www.rohm.com standard ee pr oms plug & play eeproms (for display) bu9882xx-w series (1k 2bank) general description bu9882f-w,bu9882fv-w are dual port eeproms compatible with the ddc2 tm . 2 independent ports allow 2 edid channels to be read simultaneously. features ? designed for use with ddc 2 tm ? 2-port simultaneous read function ? operating voltage range: 2.5v-5.5v ? page write function: 8bytes ? low power consumption ? active (at 5v) : 1.5ma (typ) ? stand- by (at 5v) : 0.1a (typ) ? data security ? write protection with wp ? write protection at low power supply voltage ? initial data=ffh ? data retention: 10years ? rewriting possible up to 100,000 times packages w(typ.) x d(typ.) x h(max.) bu9882xx-w series capacity type power source voltage sop14 ssop-b 14 2kbit bu9882 2.5v to 5.5v absolute maximum ratings parameter symbol ratings unit remarks supply voltage v cc -0.3 to +6.5 v power dissipation pd 0.45 (sop14) w reduce by 4.5 mw/ ? c over 25 ? c. 0. 35 (ssop-b14) reduce by 3.5 mw/ ? c over 25 ? c storage temperature tstg -65 to +1 25 operating temperature topr - 40 to + 85 terminal voltage \ -0.3 to vcc+1.0 *1 v *1 6.8v (max.) memory cell characteristics parameter limits unit min. typ. max write/erase cycle 100,000 times data retention 10 years sop 14 8.70mm x 6.20mm x 1.71mm ssop-b 14 5.00mm x 6.40mm x 1.35mm datashee t downloaded from: http:///
2/ 18 tsz02201-0r2r0g100300-1-2 ? 2012 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu9882xx-w series (1k 2bank) recommended operating ratings parameter symbol ratings unit supply voltage v cc 2.5 to 5.5 v input voltage vin 0 to vcc+1.0 electrical characteristics - dc (unless otherwise specified, ta=- 40 to + 85 ? v cc =2.5v to 5.5v) parameter symbol limits unit condition min. typ. max. h input voltage 1 vih1 2.0 - - v l input voltage 1 vil1 - - 0.8 v v cc 4.0v l input voltage 2 vil2 - - 0.2v cc v v cc 4.0v l out put voltage vol1 - - 0. 4 v sda_pc0/1, iol=3.0ma * input leakage current 1 ili1 -1 - 1 a scl_pc0/1,ddcena, banksel, vin=0v to v cc +1.0 input leakage current 2 ili2 -1 - 50 a wp output leakage current ilo -1 - 1 a sda_pc0/1,scl/sda_mon(ddcena=gnd), vout=0v to v cc +1.0 operating current i cc - 1.5 3 .0 ma fscl=400khz, v cc =5.5v twr=10ms standby current i sb - 0.1 5 a scl/sda_pc0/1=v cc scl/sda_mon=h-z ddcena= wp =banksel=gnd dualpcb=v cc *1 iol at monitor mode (ddcena high) is the sum of current flowing from the pull up resisto r at the sda_mon side to the pull up resistance at sda_pc0/pc1 - ac (unless otherwise specified, ta=- 40 to + 85 ,v cc =2.5v to 5.5v) parameter symbol fast-mode v cc =2.5v to 5.5v standard-mode v cc =2.5v to 5.5v unit typ. min. typ. max. min. typ. max. clock frequency fscl - - 400 - - 100 khz data clock high period thigh 0.6 - - 4.0 - - s data clock low period tlow 1.3 - - 4.7 - - s sda and scl rise time tr - - 0.3 - - 1.0 s sda and scl fall time tf - - 0.3 - - 0.3 s start condition hold time thd:sta 0.6 - - 4.0 - - s start condition setup time tsu:sta 0.6 - - 4.7 - - s input data hold time thd:dat 0 - - 0 - - ns input data setup time tsu:dat 1 00 - - 250 - - ns output data delay time(scl) tpd - - 0.9 - - 3.5 s stop condition setup time tsu:sto 0.6 - - 4.0 - - s bus free time tbuf 1.3 - - 4.7 - - s write cycle time twr - - 10 - - 10 ms noise spike width (sda and scl) ti - - 0.1 - - 0.1 s downloaded from: http:///
3/ 18 tsz02201-0r2r0g100300-1-2 ? 2012 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu9882xx-w series (1k 2bank) block diagram pin configuration pin descriptions pin name i/o functions v cc - power supply gnd - ground (0v) n.c. - no connection scl_pc0 in serial clock input, access to bank0 at dual port mode access to bank0 or to bank1 at single port mode sda_pc0 in/out slave and word address serial data input, serial data output access to bank0 at dual port mode, access to bank0 o r to bank1 at single port mode scl_pc1 in serial clock input access to bank1 at dual port mode, don't care at single port mode sda_pc1 in/out slave and word address serial data input, serial data output access to bank1 at dual port mode, don't care at single port mode scl_mon out serial clock output connected to scl_pc0/1 at ddcena="high", "hi-z" output at ddcena="low" sda_mon out slave and word address serial data output connected to scl_pc0/1 ddcena="high", "hi-z" output at ddcena="low" ddcena in control of scl_mon, sda_mon banksel in select a scl/sda_mon connected port at dual port mode selected a bank at single port mode dualpcb in control of dual port/single port mode in write protect control an open drain output requires a pull-up resisto r. wp n.c. n.c. wp (top view) bu9882f - w bu9882fv - w scl_pc0 sda_pc0 n.c. scl_pc1 sda_pc1 n.c. gnd v cc wp dualpcb banksel ddcena scl_mon sda_mon downloaded from: http:///
4/ 18 tsz02201-0r2r0g100300-1-2 ? 2012 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu9882xx-w series (1k 2bank) sda scl t su :sta t su :sto t hd :sta start bit stop bit synchronous data timing figure 1. synchronous data timing ? sda data is latched into the chip at the rising edge of the scl cl ock. ? the output date toggles at the falling edge of the scl clock. write cycle tim ing figure 2. write cycle timing operation notes ddcena operation when ddcena is set to high, scl_pc0/1 and sda_pc0/1 will be connected to scl_m on and sda_mon , respectively. therefore, monitoring of the communications between the pc and eepro m, and the communications of the monitor and pc, is possible. selection of pc0/pc1 is determined according to the state of the dualpcb and banksel inputs. when ddcena is low, the scl/sda_mon output is set to "hi-z". dualpcb banksel scl_mon,sda_mon (connection port) low (dual port) low pc0 port high pc1 port high (single port) low pc0 port high banksel banksel serves as an input for connection port of scl/sda_mon during dual port m ode. i t turns into the bank selection terminal of internal memory in single port mode. only the pc0 port can access the memory in single port mode. dualpcb banksel connection bank low (dual port) low pc0 port bank0 pc1 port bank1 high high (singl port) low bank0 high bank1 wp when wp=low, all data at all addresses are write-protected. the terminal has a bui lt- in pull down resister. make sure that wp=hig h when writing data. utilize this function in order to prevent incorrect write command i nput from the pc , as well as incorrect input during communication between the pc and monitor. sda (in) scl sda (out) t hd :sta t hd :dat t su :dat t buf t pd t low t high t r t f sda scl d0 ack stop condition start condition t wr write data (n) downloaded from: http:///
5/ 18 tsz02201-0r2r0g100300-1-2 ? 2012 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu9882xx-w series (1k 2bank) data read the data read function allows simultaneous read from scl_pc0/1, sda_pc0/1 in dual port mode. data write write operation is performed using either pc0/1 (scl or sda) even when a ccessed simultaneously in dual port mode. port selection is made by detecting the data d0 of the first byte of the write command input. after this, the other port is made unavailable for both read and write commands until the write operation is completed. figure 3. write cycle timing start condition all commands are preceeded by the start condition, which is a hi gh to low transition of sda when scl is high. this ic continuously monitors the sda and scl lines for the start conditi on and will not respond to any commands until this condition has been met. stop condition all commands must be terminated by a stop condition, which is a low to high transition of sda when scl is high. (see figure 1 . ) write command unless a stop condition is executed, the data will not be written into the memory array. device addressing following a start condition, the master outputs the device add ress of the slave to be accessed. the most significant four bits of the slave address are the "dev ice type indentifier". for the ic this is fixed as "1010". the next three bits are "000". the last bit of the stream determines the operation to be performe d. when set to "1", read operation is selected ; when set to "0", wri te operation is selected. r/w set to "0" ? ? ? ? ? ? ? ? write r/w set to "1" ? ? ? ? ? ? ? ? read 1010 0 0 0 r/ w D 0 0 wa 6 d7 1 1 0 0 w r i t e s t a r t r / w a c k s t o p word address data sda_pc slave address 0 wa 0 d0 a c k a c k * *:don t care d0 detected first write operation performed through the port during other port is write command. this ack is no output. downloaded from: http:///
6/ 18 tsz02201-0r2r0g100300-1-2 ? 2012 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu9882xx-w series (1k 2bank) 0 0 wa 6 d7 1 1 0 0 w r i t e s t a r t r / w a c k s t o p word address data sda line slave address 0 wa 0 d0 a c k a c k * *:don t care 0 0 d7 1 1 0 0 r e a d s t a r t r / w s t o p data sda line slave adress 0 d0 a c k a c k commands byte write when the master generates a stop condition, the ic begins an internal write cycle to the nonvolatile array. figure 4. byte write cycle timing page write after the receipt of each word, the three low order address bits are inte rnally increased by one. the four higher order bits of the address(wa6 to wa3) remain constant. this ic is capable of eight byte page write operation. if the master transnmits more than eight words, prior to generatin g the stop condition, the address counter will "roll over", and the previous transmitted data will be overwritten. figure 5. page write cycle timing current read in case the previous operation is random or current read (which in cludes sequential read), the internal address counter is increased by one from the last acceseed address (n). thus curren t read outputs the data of the next word address (n+1). if the last command is byte or page write, the internal address s tays at the last address(n). thus current read outputs the data of the word address (n). if the master does not transfer the acknowledge, but does genera te a stop condition, the current address read operation only provides a single byte of data. at this point, the bu9882/f/fv-w discontinues transmission. figure 6. current read cycle timing w r i t e s t a r t r / w a c k s t o p word address data(n) sda line a c k a c k *:don t care a c k slave address 1 0 0 0 1 0 0 0 0 wa 6 d0 d7 d0 wa 0 * 1 data(n+7) downloaded from: http:///
7/ 18 tsz02201-0r2r0g100300-1-2 ? 2012 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu9882xx-w series (1k 2bank) w r i t e s t a r t r / w a c k s t o p word addre ss sda line a c k a c k data(n) a c k slave address 1 0 0 0 1 0 0 0 0 wa 6 0 d0 slave address 1 0 0 0 1 0 0 0 s t a r t d7 r / w r e a d wa 0 * 0 *:don t care carecareda r e a d s t a r t r / w a c k s t o p data(n) sda line a c k a c k data(n+x) a c k slave address 1 0 0 0 1 0 0 0 0 d0 d7 d0 d7 random read random read operation allows the master to access any location. if the master does not transfer the acknowledge but does generate a stop condition, the current address read operatio n only provides a single byte of data. (at 1kbit all address read possible).this communication must be terminated by a stop condition, which is a low to high transition of sda when scl is high figure 7. random read cycle timing sequential read during the current read operation, if an acknowledge is detected, and no stop condition is generated by the master(-com), the device will continue to transmit the data. (it ca n transmit all data(1kbit 128word)). if an acknowledge is not detected, the devive will terminate further data transmissio ns and await a stop condition before returning to the standby mode. the sequential read operation can be performed w ith both current read and random read. figure 8. sequential read cycle timing peripheral circuits dual port dual ports are used to connect two pcs to one monitor. pc0 is connected t o bank0 and pc1 to bank1. each bank operates as 1kbit eeprom. to use dual port start the operation of the dual port by following the instructions be l ow : 1. set the dual pcb to low with neither of the ports being operated by com mands. 2. input the command from pc0 or pc1. simultaneous access eeprom data read allows simultaneous access from pc0, pc1 ports. write operation is performed for either of pc0/1 even when accessed simultaneously from both. port selection is made by detecting the data d0 of the first byte of the write command input. write operation is performed only for the port where d0 of the f irst byte of the write data is detected first. figure 9. example of peripheral circuit with dual port wp pc 0 monitor cpu cc sda scl sda scl pc 1 scl_pc0 sda_pc0 nc scl_pc1 sda_pc1 nc gnd v cc dualpcb banksel ddcena scl_mon sda_mon bank0 (1kbit) bank1 (1kbit) downloaded from: http:///
8/ 18 tsz02201-0r2r0g100300-1-2 ? 2012 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu9882xx-w series (1k 2bank) sda scl pc 0 monitor cpu cc v cc wp dualpcb banksel ddcena scl_mon sda_mon bank0 (1kbit) bank1 (1kbit) scl_pc0 sda_pc0 nc scl_pc1 sda_pc1 nc gnd monitor output bu9882f-w, bu9882fv-w has a monitor output terminal . this allows communication between the pc and moni tor cpu. the monitor output for the use of dual port can be switched with banksel input , as shown in the table below. single port single port is for connecting one pc to one monitor. in this case, it i s accessible only from pc0. bank selection is made with banksel. switching this banksel allows access to the total of 2kbit eeprom, with bank0 a nd bank1, from pc0. to use single port start the single port operation by following the instructions below: 1. set the dual pcb to high with neither of the ports being operated by com mands. 2. select the bank with banksel. 3. input the command from pc0. banksel input scl_mon,sda_mon connection port low pc0 port high pc1 port figure 10. simultaneous access of read operation sda-pc0 bus 1 1 wa 0 *wa 6 sda-pc1 bus s t a r t 1 1 slave address bank0 word address(w) write operation performed through the port. r / w d 0 d 7 st o p no ack bank1 word address(w) d 0 d 7 st o p fig.27 simultaneous access of write operation figure 11. simultaneous access of white operation *wa 6 wa 0 *wa 6 wa 0 *:don t care carecareda ta(n) s t a r t 1 1 d 0 d 7 1 1 d 0 d 7 a c k a c k s t o p slave address output data from bank0 sda-pc0 bus sda-pc1 bus r / w fig.26 simultaneous access of read operation output data from bank1 1 1 d 0 d 7 sda-pc1 bus output data from bank1 figure 12. example of peripheral circuit with single port downloaded from: http:///
9/ 18 tsz02201-0r2r0g100300-1-2 ? 2012 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu9882xx-w series (1k 2bank) software reset execute software reset in case the device is at an unexpe cted state after power up and/or the command input needs to be reset. the following figures (figure 13-(a), figure 13-(b), figure 1 3-(c)) during dummy clock, please release sda bus (tied to vcc by pull up resi stor). during that time, the device may pull the sda line low for ack nowledge or outputting read data. if the master controls the sda line high, it will conflict with the device output low then it ma kes a current overload. it may cause instantaneous power down and may damage the device. acknowledge polling since the device ignores all input commands during the internal write cycle, no ack will be returned. w hen the master sends the next command following the write command, and the device returns the ack, it means that the prog ram is completed. if no ack is returned, it means that the device is still busy. by using acknowledge polling, the waiting tim e is minimized to less than twr=5ms. to prevent operating write or current read immediately after write, first send the slave addr ess (r/w is "high" or "low"). after the device returns the ack, continue word address input or data output, respectively. word address s t a r t the first write command a c k h a c k l slave address data write command twr twr the second write command s t a r t s t a r t s t a r t s t a r t s t o p s t o p a c k h a c k h a c k l a c k l during the internal write cycle, no ack will be returned. (ack=high) slave address slave address slave address after the internal write cycle is completed ack will be returned (ack=low). then input next word address and data. figure 14. successive write operation by acknowledge polling figure 13-(c) start 9 figure 13-(b) start dummy clock 9 start command command command command command command 1 2 13 14 scl dummy clock 14 start 2 scl scl figure 13-(a) dummy clock 14 start start 1 2 3 8 9 7 2 1 8 9 dummy clock 9 start start start 9 sda sda sda downloaded from: http:///
10 / 18 tsz02201-0r2r0g100300-1-2 ? 2012 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu9882xx-w series (1k 2bank) command cancellation by start and stop condition during a command input, command is canceled by the successiv e inputs of start condition and stop condition (figure 15.). however, during ack or data output, the device may output the sda line low. in such cases, operation of start and stop condition is impossible, making the reset inoperable. execut e the software reset in the cases. (figure 13.) operating the command cancels by starts and stop condition du ring the command of random read or sequential read or current read, internal address counter is not confirmed. therefore ope ration of current read after this is not valid. operate a random read in this case. figure 15. command cancellation i/o circuit sda pin pull-up resister the pull up resister is needed because sda is nmos open drain. choo se the correct value of this resister(r pu ), by considering vil, il characteristics of a controller which control the de vice and voh, iol characteristics of the device. if large r pu is chosen, clock frequency needs to be slow. in case of sm all r pu , the operating current increases. maximum rpu maximum value of r pu is determined by following factors: sda rise time determined by r pu and the capacitance of bus line(cbus) must be less than tr. 1) other timing must keep the conditions of ac spec. when sda bus is high, the voltage a of sda bus determined by a total input leak(il) of the all devices co nnected to the bus. r pu must be significantly higher than the high level input of a controller and the device, including a noise margin 0.2v cc . v cc -ilr pu -0.2 v cc vih r pu 0.8vcc-v ih il examples: when v cc =3v il=10a vih=0.7v cc according to r pu 0.8x3-0.7x3 10x10 -6 300 [k ] the capacitance of bus line (cbus) sda pin r pu a il il micro computer figure 16. i/o circuits scl sda 1 1 0 0 start condition stop condition downloaded from: http:///
11 / 18 tsz02201-0r2r0g100300-1-2 ? 2012 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu9882xx-w series (1k 2bank) minimum r pu the minimum value of r pu is determined by following factors: meets the condition that v olmax =0.4v, i olmax =3ma when the output is low. v olmax =0.4v must be lower than the input low level of the microcontroller an d the eeprom including the recommended noise margin of 0.1v cc . volmax vil-0.1 v cc examples: v cc =3v, vol=0.4v, iol=3ma, the vil of the controller and according to 867 r pu 3-0.4 310 -3 the eeprom is vil=0.3v cc , and vol=0.4 v vil=0.3 3 =0.9 v so that condition is met scl pin pull-up resister when scl is controlled by the cmos output the pull-up resistor at scl is not required. however, should scl be set to hi -z, connection of a pull-up resistor between scl and v cc is recommended. several k are recommended for the pull-up resistor in order to drive the output port of the microcontroller. notes for power supply v cc rises through the low voltage region in which the internal circu it of the ic and the controller are unstable. therefore, the device may not work properly due to an incomplete reset of the i nternal circuit. to prevent this, the device has a p.o.r. and lv cc feature. at power up, maintain the following conditions to ensure fu nctions of p.o.r and lv cc . 1. "sda='h'" and "scl='l' or 'h' ". 2. follow the recommended conditions of t r , t off , vbot for the p.o.r. function during power up. toff tr vbot 0 fig.33 vcc rising wave from v cc 3. prevent sda and scl from being " hi -z". in case conditions 1 and/or 2 cannot be met, take followin g actions: a) if u nable to keep condition 1 ( sda is "low" during power up): control sda, scl to be "high" as shown in figure below. tlow tsu:da tdh after vcc becom scl v cc sda fig.34 scl="h" and sda= "l" tsu:da fig.35 scl="l" and sda="l" after vcc becom b) if u nable to keep condition 2. after power becomes stable ? execute software reset. (see figure 13.) c) if unable to keep both conditions 1 and 2. follow the instruction a first ? then the instruction b. recommended conditions of tr, toff, vbot tr toff vbot below 10ms above 10ms below 0.3v below 100ms above 10ms below 0.2v v cc -v ol r pu i ol r pu v cc -v ol i ol figure 17. figure 19. figure 18. downloaded from: http:///
12 / 18 tsz02201-0r2r0g100300-1-2 ? 2012 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu9882xx-w series (1k 2bank) lv cc circuit lv cc circuit inhibits write operation at low voltage, and preve nts an inadvertent write. write operation is inhibited below the lv cc voltage (typ.=1.2v ). vcc noise bypass condenser noise and surges on power line may cause abnormal functio n. it is recommended that the bypass condensers (0.1f) are attached on the vcc and gnd line beside the device. it is also recommended to attach bypass condensers on the board close to the connector. cautions on use 1) reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic s power supply pin s. 2) power supply l ine s design the pcb layout pattern to provide low impedance supply lines. furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacita nce value when using electrolytic capacitors. 3) ground voltage ensure that no pins are at a voltage below that of the ground pi n at any time, even during transient condition. 4) ground wiring pattern when using both small-signal and large-current ground tra ces, the two ground traces should be routed separately but connected to a single ground at the reference point of the a pplication board to avoid fluctuations in the small-sign al ground caused by large currents. als o ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short a nd thick as possible to reduce line impedance. 5) thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceedi ng this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6) recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtaine d . the electrical characteristics are guaranteed under the condi tions of each parameter. 7) inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence an d delays, especially if the ic has more than one power supply. therefore, give special consideration to power coup ling capacitance, power wiring, width of ground wiring, a nd routing of connections. 8) operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9) testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or st ep. the ics power supply should always be turned off completely before connectin g or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10) inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) a nd unintentional solder bridge deposited in between pins during a ssembly to name a few. 11) unused input pins input pins of an ic are often connected to the gate of a mos tra nsistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small c harge acquired in this way is enough to produce a significan t effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specifie d, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
13 / 18 tsz02201-0r2r0g100300-1-2 ? 2012 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu9882xx-w series (1k 2bank) cautions on use - continued 12) regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitably formed creating parasitic diodes or transistors. the operatio n of these parasitic elements can result in mutual interferen ce among circuits, operational faults, or physical damag e. therefore, conditions which caus e these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the ic. even if the power suppl y voltage is applied, make sure that the input pin s have voltages within the values specified in the electrical characte ristics of this ic . downloaded from: http:///
14 / 18 tsz02201-0r2r0g100300-1-2 ? 2012 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu9882xx-w series (1k 2bank) ordering information product code description b u 9 8 8 2 x x - w x x package f :sop 14 fv :ssop-b14 double cell packaging and forming specification e2 : embossed tape and reel (sop14, ssop-b14) lineup capacity package type quantity 2k sop 14 reel of 2500 ssop-b14 downloaded from: http:///
15 / 18 tsz02201-0r2r0g100300-1-2 ? 2012 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu9882xx-w series (1k 2bank) physical dimension tape and reel information sop 14 downloaded from: http:///
16 / 18 tsz02201-0r2r0g100300-1-2 ? 2012 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu9882xx-w series (1k 2bank) physical dimension tape and reel information - continued ssop-b14 downloaded from: http:///
17 / 18 tsz02201-0r2r0g100300-1-2 ? 2012 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu9882xx-w series (1k 2bank) marking diagrams marking information capacity product name marking package type 2k bu9882 sop 14 9882 ssop-b14 sop14 (top view) part number marking lot number 1pin mark ssop-b14 (top view) part number marking lot number 1pin mark downloaded from: http:///
18 / 18 tsz02201-0r2r0g100300-1-2 ? 2012 rohm co., ltd. all rights reserved. 21.aug.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu9882xx-w series (1k 2bank) revision history date revision changes 19.jul.2012 001 new release 21 .aug.2015 00 2 dip14 delete changed operational note downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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